Our PCB assembly operation support high and low mix and backplane assembly for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to thousands in volume production.

Our PCB assembly services are complemented by strong front-end product development capabilities including CAD (Computer Aided Design) layout and design expertise. Quality is foremost and to meet UL & CSA requirements, our manufacturing systems are able to provide product traceability down to component level.

Our process and manufacturing capabilities include:
  • SAP B1 ERP for integrated manufacturing resource planning
  • Manufacturing Shop floor (COMS) Traceability System
  • Ten zone convection reflow oven
  • PTH Components Assembly
  • BGA / CSP Surface Mount Technologies
  • Off-line/ cartridge feeder for optimal high mix SMT
  • X Ray Inspection System
  • Automated optical inspection (AOI)
  • BGA / CSP Rework Capability
  • Leadfree /RoHS Wave Soldering Solutions
  • Full Electrical Test Solutions (ICT & PreTest)
  • ISO 9001 Quality Control System
  • Maximum board size 24” X 24”